The strongest of the potting compounds epoxies are rigid and wear resistant.
Electrical potting compound.
The potting compound fills the component enclosure entirely leaving no air gaps.
Tough seal potting compound tough seal is a superior family of key sealants for potting electrical and electronic components that provides a reliable grip and exceptional encapsulating protection for any potting application where premium thermal cycling performance excellent thermal shock resistance and outstanding environmental and corrosion protection are a must.
Electrical and electronic potting compounds are designed to insulate and protect electrical and electronic components from the application and environmental stresses.
Features a non halogen filler.
Epoxy potting compounds encase electronic assemblies in a layer of epoxy for protection from dust chemicals moisture mechanical shock and vibration.
Potting encapsulation casting compound meets uv 94v 0 flame retardant specifications.
We offer a comprehensive selection of low cost epoxy and polyurethane potting compounds to meet the most demanding specifications.
In electronics potting is a process of filling a complete electronic assembly with a solid or gelatinous compound for high voltage assemblies by excluding gaseous phenomena such as corona discharge for resistance to shock and vibration and for the exclusion of water moisture or corrosive agents.
Potting compounds for effective potting of electronics to protect against environmental influences improve mechanical strength high electrical insulation.
Convenient one to one mix ratio by weight.
Outstanding electrical insulation characteristics.
Epoxy potting compounds mg chemicals offers a wide range of epoxy potting compounds for protecting printed circuit boards and electronic devices.
As a result heat is dissipated within the enclosure and rapidly conducted to the heat sink which has enabled substantial size and weight reductions of the finished component.
These epoxy formulations provide superior protection against water chemical mechanical thermal and electrical shock.
It is non corrosive to copper minimal exotherm and very low shrinkage making it well suited for potting and bonding electronic and electrical components.
Max mcr electronic grade epoxy potting compound 48 ounce kit for electronic potting and encapsulation waterproofing permanent circuit masking none electrically conductive epoxy resin.